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Identify the packaging schemes of the following types of commercial devices. Identify the scheme for both circuit-mechanical integration and for encapsulation.
* InvenSense gyro (ITG-3200) (Link)
* STMicroelectronics gyro L3G4200 D (Link)
* Texas Instrument digital micro mirror (DMD)
|ITG 3200 (Link to review)||circuits and mechanical elements are contained on two chips, but placed in one package.(Fig. 1 below)||Vacuum wafer bonding, Nasiri process. (Fig. 2)|
|L3G4200D (Link to Chipworks review)||Circuit and mechanical elements are bonded together to form a single chip; (see Fig. 2 below).||vacuum wafer bonding encapsulation|
|Texas Instruments DLP||Monolithic integration, mechanical on top of MOS electronics; low temperature process and materials for mechanical parts (Al as mirror and photoresist as sacrificial wafer) (see Fig. 4 below)||package level vacuum encapsulation (see Fig. 5 below)|
Fig. 1: Side view of ITG3200.
Fig. 2: The Nasiri process for making ITG3200.
Fig. 3: L3G4200D chip
Fig. 4: Scanning electronics micrograph of TI DLP Chip.
Fig. 5. A picture of the TI DLP package.