Wire bonding is important for establishing electrical contacts between a chip and the pcakage. Wire bonding can be done through wedge bonding, ball bong, and ultrasonic bonding. These types of bonding can be achieved at low speed (typically in a research lab) and high speed (at industrial facilities).
An animation of the wedge bonding process.
A ball bonding process.
A video clip of industrial strength high speed wire bonding.
A video of a equipment for die picking and wire bonding. This machine picks diced silicon dies from a wafer automatically and place them on chips for assembly. Dies are placed precisely using optical imaging.